IR-E2 Technical Features
Focused Infrared:
150W Focused, adjustable, visible infrared heating delivers precise energy where needed, while remaining gentle on sensitive assemblies.
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Independent PCB and Component Temperatures:
True independent control of PCB and component temperatures for maximum process flexibility and protection.
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Automatic ThermoActive Software:
Simple software with automatic profiling that manages the thermal process for you.
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PCB Preheater:
2800W Three-zone medium wave quartz infrared preheating delivers controlled, even thermal conditioning across the PCB, reducing thermal gradients, minimising stress, and creating stable conditions for repeatable rework.
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SMT/BGA Alignment:
Accurate optical alignment for reliable, repeatable placement of SMT and BGA components.
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PCB Workholder:
Stable, adjustable PCB support that positions the board correctly over the preheater and helps prevent warping during rework.
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Nest/Flux Application:
Precise application of flux or solder paste directly to components for consistent preparation.
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IR-E2 Technical Data
Max PCB Size: 12 x 18”/300 x 450mm
Max Component Size: 2.1 x 2.1”/55 x 55mm
Min Component Size: 01005
Component Removal: Manual Pick-Up System
Component Placement: Split Beam Prism Alignment/x50 Magnification
Placement Accuracy: Up to 10um
Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
PCB Preheater Power: 2800W Medium-Wave IR (3 Zones)
PCB Preheater Heating Area Size: 14.1 x 9.4”/360 x 240mm
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Contact Probe
Number of TC Channels: 4