IR-E6 Technical Features
Focused Infrared:
150W Focused, adjustable, visible infrared heating delivers precise energy where needed, while remaining gentle on sensitive assemblies.
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Gantry (E6):
Extended XY gantry travel designed for large PCBs and accurate handling of components at the board edges.
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Independent PCB and Component Temperatures:
True independent control of PCB and component temperatures for maximum process flexibility and protection.
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Automatic ThermoActive Software:
Simple software with automatic profiling that manages the thermal process for you.
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PCB Preheater:
3200W Three-zone medium wave quartz infrared preheating delivers controlled, even thermal conditioning across the PCB, reducing thermal gradients, minimising stress, and creating stable conditions for repeatable rework.
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SMT/BGA Alignment:
Accurate optical alignment for reliable, repeatable placement of SMT and BGA components.
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PCB Workholder:
Stable, adjustable PCB support that positions the board correctly over the preheater and helps prevent warping during rework.
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Side View Camera:
Live side-view monitoring with image capture for clear visibility and process verification.
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Nest/Flux Application:
Precise application of flux or solder paste directly to components for consistent preparation.
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PCB Cooling:
Assisted PCB cooling to stabilise solder joints after reflow and support safe handling.
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IR-E6 Technical Data
Max PCB Size: 18 x 24”/460 x 620mm
Max Component Size: 2.1 x 2.1”/55 x 55mm
Min Component Size: 01005
Component Removal: Manual Pick-Up System
Component Placement: Split Beam Prism Alignment/x50 Magnification
Placement Accuracy: Up to 10um
Top Heater Power: 150W Focused Infrared up to Ø70mm Spot on Gantry System
PCB Preheater Power: 3200W Medium-Wave IR (3 Zones)
PCB Preheater Heating Area Size: 19.6 x 9.4”/500 x 240mm
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Non-Contact IR Sensor
Number of TC Channels: 4