IR-E3 Pro Technical Features
150W Focused, adjustable, visible infrared heating delivers precise energy where needed, while remaining gentle on sensitive assemblies.
Large-head visible focused infrared heating designed for components between 55mm and 85mm, delivering controlled, concentrated energy for stable, repeatable rework of high-mass packages.
True independent control of PCB and component temperatures for maximum process flexibility and protection.
Simple software with automatic profiling that manages the thermal process for you.
2800W Three-zone medium wave quartz infrared preheating delivers controlled, even thermal conditioning across the PCB, reducing thermal gradients, minimising stress, and creating stable conditions for repeatable rework.
Accurate optical alignment for reliable, repeatable placement of SMT and BGA components.
Stable, adjustable PCB support that positions the board correctly over the preheater and helps prevent warping during rework.
Live side-view monitoring with image capture for clear visibility and process verification.
Precise application of flux or solder paste directly to components for consistent preparation.
Assisted PCB cooling to stabilise solder joints after reflow and support safe handling.
IR-E3 Pro Technical Data
Max PCB Size: 24 x 24”/620 x 620mm
Max Component Size: 3.3 x 3.3”/85 x 85mm
Min Component Size: 01005
Component Removal: Manual Pick-Up System
Component Placement: Split Beam Prism Alignment/x50 Magnification
Placement Accuracy: Up to 10um
Top Heater Power: 150W Focused Infrared up to Ø100mm Spot
PCB Preheater Power: 2800W Medium-Wave IR (3 Zones)
PCB Preheater Heating Area Size: 14.1 x 9.4”/360 x 240mm
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Non-Contact IR Sensor
Number of TC Channels: 4
