IR Rework Station - Product Range
X-Ray Inspection - Product Range
High quality X-Ray inspection for Production, Research and Development, and MRO applications.
Detect a wide range of manufacturing/process defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking, mis-alignment and bridging.
BGA rework without the complications
The PDR rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
The rework station is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications. The station is well specified yet can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4000 customers.
Simple BGA rework procedure
BGA rework poses the problem of accessing hidden interconnects in a high density environment. Consequently, it requires a station that is able to access the hidden joints without affecting neighbouring components. A station that is safe, gentle, adaptable and, above all, simple to operate. The PDR Rework Station is such a station. It is so easy to operate that technicians are able to instantly achieve excellent process control for BGA/SMT rework without the complexities and frustrations normally associated with ‘high-end’ rework stations.
Paste - Place - Reflow
With the aid of excellent mechanics, optics and control, operators can simply pick up the fluxed BGA from the nest, align it, place it onto the PCB’s pads and then reflow with the station’s accurate PC based, closedloop component and PCB temperature control.