IR-E6 Evolution
Ultimate Performance, BGA Rework Station for small-large PCBs upto 24"/620mm
The IR-E6 Evolution XL rework system is made in the United Kingdom with only the finest components for optimum precision. The PDR IR-E6 is our largest system and one of the best performing BGA Rework Stations worldwide.
The IR-E6 is very high powered with a multi-zone, 3200W PCB preheater and is designed to rework small to large PCB assemblies with upto a 24"/620mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.
High Performance
The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
The IR-E6 is well specified yet can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.
Simple BGA Procedure
BGA rework poses the problem of accessing hidden interconnects in a high density environment. Consequently, it requires a system that is able to access the hidden joints without affecting neighbouring components. A system that is safe, gentle, adaptable and, above all, simple to operate. The IR-E6 is such a system. It is so easy to operate that technicians are able to instantly achieve excellent process control for BGA/SMD rework without the complexities and frustrations normally associated with ‘high-end’ rework systems.
Paste - Place - Reflow
With the aid of excellent mechanics, optics and control, operators can simply pick up the fluxed BGA from the nest, align it, place it onto the PCB’s pads and then reflow with the system’s accurate PC based, closedloop component and PCB temperature control.
Advanced Features
- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system
- Quartz IR PCB preheating
3200W, two zone (500mm x 270mm heating area)
- Precision Component Pick and Placement
Advanced Professional vacuum placement system
- Component Nest/Flux Application Facility
Integrated nest with flux dip tray or component print frame
- Precision PCB Handling
Advanced Professional PCB table with macro-micro X/Y
- Component Temperature Sensing
Standard non-contact IR temperature sensor
- PCB Temperature Sensing
Standard non-contact IR temperature sensor
- Advanced Thermal Process Control
Software based auto profile thermal control
- Camera/Prism Based BGA/CSP/QFN Alignment System
Split beam prism system for simultaneous PCB/component viewing
- Auxiliary Process Camera (Optional)
High magnification camera and LED lighting
- Forced Air PCB Cooling (Optional)
Highly effective, integral PCB cooling with air knife system
Technical Specifications
- Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system
PDR lens attachments with IR image from 4 to 70mm diameter
Reworks all SMDs/ BGAs/QFNs/CSPs including 0201s + lead free applications
- Quartz IR PCB preheating
High power, medium wave quartz IR
Large area IR PCB preheater system
3200W, two zone, 2 x 1600W, (500mm x 270mm heating area)
- PDR lens attachments
F150 (Ø4 - 18mm spot size) optional
F200 (Ø10 - 28mm spot size) optional
F400 (Ø12 - 35mm spot size) optional
F700 (Ø25 - 70mm spot size) standard
- Advanced Professional Vacuum Placement System
With precise ‘pick and place’ action, Y/Z axis movement and rotation
Soft component landing, Z-axis stop, LED guidance for paste placement
Interchangeable pick-up heads for different applications
- Component Nest for Precision Pick-up and Flux Application
With integrated nest with ‘component print frame’, dip tray or mini
stencil paste-head facility for flux and solder paste application
- Advanced Professional Macro-Micro X/Y PCB Table
Precision micrometer (micro) X/Y and micro rotation control
+/- 10 microns (.0004”) movement in X/Y directions
Macro movement in X/Y directions
Up to 18” x 24” (460mm x 620mm) PCB capacity with lockable X/Y axis
X/Y Table has 1” x 1” micro- movement plus macro adjustment
System has a gantry feature. Topside of machine moves in X and Y direction
- Component Temperature Sensing - Non-contact, IR Sensor
Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
Real time monitoring of component temperature throughout process
- PCB Temperature Sensing - Non-contact, IR Sensor
Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
Real time monitoring of component temperature throughout process
- Auto Profile Process Control Software
PDR ThermoActive software suite
Digital controller with multi-functional features
Advanced, Windows 7+ ThermoActive software suite
Two channel, real time, closed loop component and PCB temperature control
‘Auto-profile’ temperature profiling, data logging and reporting
Multi K-type thermocouple (x4) capacity for temp/time testing
- Camera/Prism Based BGA/CSP/QFN Alignment System
Split beam prism system for simultaneous PCB/component viewing
Integral LED lighting system with illumination level control
Full colour compact camera and flat screen colour monitor
High quality zoom lens with up to x50 magnification
Precise X/Y axis mounting system
- Auxiliary Process Camera(Optional)
Auxiliary process observation camera
Integral LED lighting system with illumination level control
Full colour compact camera with rotation movement
High quality zoom lens with up to x50 magnification
- Forced Air PCB Cooling (Optional)
Highly effective, integral PCB cooling with air knife system
Switched compressed air flow, directed under the PCB
Bench Top Requirements
| Top heat power | 150W IR |
| Back heater power | 3200W, 2 Zone, 2 x 16700W |
| Voltage/frequency | 208-240 volts 50/60Hz, up to 3KW |
| Typical components | CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs |
| Bench area | 2000mm (w) x 1000mm (d) |
| Weight | 100 Kg |
The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.
Video
Download Brochure
Social Media
