IR-E3 Evolution Series
Ultimate Performance, BGA / uBGA / SMD / QFN Rework System for PCBs upto 18"/450mm

SMD / BGA / uBGA / QFN / LED Rework with Focused IR
The PDR IR-E3 is a high powered system, available with a multi-zone 2250W, 2800W or 3050W PCB preheater and is designed to rework SMD / BGA / uBGA / QFN / LEDs on small to medium-large PCB assemblies with upto a 18"/450mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.
The IR-E3 system is now available in 3 models - the E3S, E3G and E3M. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-E3 is our top selling system and one of the best performing BGA Rework Stations worldwide.
Multi-purpose flexible rework focused on precision and simplicity
PDR’s IR-E3 series of SMD/BGA IR rework systems are engineered to cope with the challenges of repairing today’s PCB assemblies. The systems use PDR’s patented Focused IR technology, the world’s only technology that uses Dual-band Visible IR Heating. The light that heats.
The stations are nozzle free, gas free, clean, simple and easy to use. Each model is designed for precise control to produce 100% yield of your SMD/BGA rework without complications. The keys are accurate closed-loop thermal feedback and intuitive easy to use software. The IR-E3 series provides extremely high levels of profiling and process control necessary for the effective rework of the most advanced packages, including SMDs, BGAs, CSPs, QFNs, LEDs, Flip-chips, 0201-01005s and all lead-free applications.
The PDR IR-E3 systems are available in 3 models - E3S, E3G and E3M - each configured perfectly for their respective roles.
PDR IR-E3S
Developed from PDR’s pioneering IR rework stations from the 1990-2000s, the IR-E3S, is the standard of the E3 Series. Featuring: Focused IR Component heating, 2250w 2-zone IR PCB preheating, precision mechanics, precision optical alignment and advanced thermal control. The E3S system is flexible, upgradeable and ideal for general purpose SMD/BGA rework on small-medium sized PCBs.
PDR IR-E3G
Enhanced, the E3G adds superior thermal control and twin cameras for precision alignment and process observation. Non-contact pyrometers focus on the component and the PCB, for thermal feedback to auto-profiling ThermoActive V7 software. With camera input, the software also permits still and video capture. Mechanical advancements feature precision soft touch component pick up and placement. This system also features large IR 3050W 3-zone IR PCB preheating.
The PDR IR-E3G has been our top selling station for many years, a clear preferred choice of our customers worldwide. A versatile complete system that is ideal for a very wide range of SMD/BGA/ uBGA/CSP/LED applications on small-large sized PCBS.
PDR IR-E3M
Introduced in response to our customer demands, we took the E3G and further enhanced it for Micro-rework applications. In addition to general purpose applications, the IR-E3M’s thermal, mechanical and optical features are all precisely focused to easily deal with micro components and micro PCBs. In addition to the 3050w micro-PCB preheater, a 750w electronic Thermo Boost is included along with non-contact thermal control. High-magnification vision assisted component alignment, pick-up and ultra-fine placement complete the micro-process handling. This system is absolutely ideal for micro component-PCB rework without complications.
SMD/BGA rework without the complications
Put simply, without any complications, our systems can pick and place micro components or large BGAs and reflow small or large boards with precision and control. The PDR IR process is simple, safe and gentle. Precise control prevents burning or damage to materials. We can visually show the process, record it and repeat it precisely every time. Anyone can learn to use these systems and they are affordable.
Each of the IR-E3 Series rework systems use the same principals of PDR’s Focused IR technology, first introduced in 1987. Over 4,500 systems are now in use world-wide. Each PDR customer made a clear well informed decision to buy PDR IR technology. Please contact us to learn why they chose PDR.
Advanced Features





North American specifications may differ
- Advanced Focused IR component heating
Dual-band Visible IR Heating system
150W, lens based Focused IR heating with adjustable
image system Ø4-70mm
- Quartz IR PCB preheating
E3S - 2250W, two zone (240mm x 240mm heating area)
with 750W Micro-PCB Thermo Boost
E3G - 3050W, three zone (360mm x 240mm heating area)
with 750W Micro-PCB Thermo Boost
E3M - 3050W, three zone (360mm x 240mm heating area)
with 750W Micro-PCB Thermo Boost
- Precision Component Pick and Placement
Advanced Professional vacuum placement system
Soft-touch component landing
- Component Nest/Flux Application Facility
Integrated nest with flux dip tray or component
print frame and optional Optical assist
- Precision PCB Handling
Advanced Professional PCB table with macro-micro X/Y
- Component Temperature Sensing
Standard non-contact IR temperature sensor
- PCB Temperature Sensing
K-type wire thermocouple
Optional non-contact IR temperature sensor
- Advanced Thermal Process Control
Software based auto profile thermal control
- Camera/Prism Based BGA/CSP/QFN
Alignment System
Split beam prism system for simultaneous
PCB/component viewing
High mag camera-lens optics
- Auxiliary Process Camera (Optional)
Auxiliary process observation camera
Ultra-high mag camera-lens optics
- PCB Cooling (Optional)
Highly effective, integral PCB cooling with air
knife system
Technical Specifications
North American specifications may differ
- Advanced Focused IR component heating
Dual-band Visible IR Heating system
150W, lens based Focused IR heating with adjustable image system
PDR lens attachments with IR image from 4 to 70mm diameter
Reworks SMD, BGA, uBGA, QFN, LED, uLED, 0201 etc.
- PDR Lens Attachments
FF150 (Ø4 - 18mm spot size)
F200 (Ø10 - 28mm spot size)
F400 (Ø12 - 35mm spot size)
F700 (Ø25 - 70mm spot size)
- Quartz IR PCB preheating Flexi-array Dark IR PCB preheater system
High power, medium wave quartz IRE3S - 2250W, two zone (240mm x 240mm heating area) with
750W Micro-PCB Thermo Boost
E3G - 3050W, three zone (360mm x 240mm heating area) with
750W Micro-PCB Thermo Boost
E3M - 3050W, three zone (360mm x 240mm heating area) with
750W Micro-PCB Thermo Boost
- Advanced Professional Vacuum Placement System
With precise ‘pick and place’ action, Y/Z axis movement and rotation via,
Magna-Track Precision Pick-Up Assembly with Micro-Touch soft landing/component lift
Fine approach, Z-axis stop, with LED indicators for paste placement
Comprehensive range of micro pick-up tips for different devices
E3M - Venturi Powered Vacuum Assist for EZ Ground Plane Detach
(70-140PSI Shop Air)
- Component Nest for Precision Pick-up and Flux Application
Solder Paste/Dipping Tray facility with process Camera Verification
Micro Part Pick-Up nest with Optical Assist
- Advanced Professional Macro-Micro X/Y PCB Table
Precision micrometer (micro) X/Y and micro rotation control
+/- 5 microns (.0004”) movement in X/Y directions
Macro movement in X/Y directions
From 0.25”x 0.25” up to 12” x 18” (300mm x 450mm) PCB capacity with lockable X/Y axis
E3M - Optional Universal PCB Pallet to emulate larger PCB Surface area (USA Option)
- Component Temperature Sensing - Non-contact, IR Sensor
Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
Real time monitoring of component temperature throughout process
- PCB Temperature Sensing
Manually attached K-type thermocouple probe
Optional non-contact IR sensor with real time temperature sensing
- Auto Profile Process Control Software
PDR ThermoActive software suite
Digital controller with multi-functional features
Advanced, Windows 7+ ThermoActive software suite
Two channel, real time, closed loop component and PCB
temperature control
‘Auto-profile’ temperature profiling, data logging and reporting
Multi K-type thermocouple (x4) capacity for temp/time testing
- Camera/Prism Based BGA/uBGA/CSP/QFN Alignment System
Split beam prism system for simultaneous PCB/component viewing
Integral LED lighting system with illumination level control
Full colour compact camera and flat screen colour monitor
High quality zoom lens with up to x50 magnification
Precise X/Y axis mounting system
- Auxiliary Process Camera (Optional)
Auxiliary process observation camera
Integral LED lighting system with illumination level control
Full colour compact camera with rotation movement
High quality zoom lens with up to x50 magnification
- Forced Air PCB Cooling
Highly effective, Software controlled, integral PCB cooling with air knife system
Switched compressed air flow, directed under the PCB
Bench Top Requirements
Top heat power | 150W IR |
Back heater power | 2250-3050W IR |
Voltage/frequency | 208-240 volts 50/60Hz, up to 3KW |
Typical components | SMD, BGA, uBGA, QFN, LED, uLED, 0201 etc. |
Bench area | 1400mm (w) x 600mm (d) |
Weight | 65 Kg |
The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.