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PDR IR-E3 Evolution - BGA Rework Station

Focused IR SMD/BGA Rework for Small-large PCBs to 450mm (18")

Made in the UK

SMD / BGA Rework with Focused IR

The PDR IR-E3 is a high powered BGA rework system using IR top and bottom. Using Focused IR component heating, with a powerful, multi-zone, Quartz IR PCB preheater, it is designed to rework all SMDs / BGAs on small to large PCB assemblies. The system is loaded with high quality, advanced features, delivering the highest quality soldering performance, on difficult applications, yet it remains so simple to set up and use.

    Main features include:

  • Focused IR Component Heating
  • Quartz IR PCB Preheating
  • Reworks SMD, microSMD, BGA, uBGA, CSP, QFN, LED, uLED, 0201 etc
  • PCBs from 6mm (1/4") to 450mm (18")
  • Ultra-precision Component Alignment and Placement
  • Automatic Thermal Control Software
  • Tool-Nozzle-free, Ultra-high Yield, Easy to set up and use.

This IR Rework product is made in the United Kingdom with only the finest components for optimum quality and precision. The PDR IR-E3 is our top selling rework system, with a rework technology heritage of 37+ years, with over 4500 systems.  It remains one of the best performing BGA Rework Stations available anywhere, worldwide.

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Multi-purpose flexible rework focused on precision and simplicity

PDR’s IR-E3 series of SMD/BGA IR rework systems are engineered to cope with the challenges of repairing today’s PCB assemblies. The systems use PDR’s patented Focused IR technology, the world’s only technology that uses Dual-band Visible IR Heating. The light that heats.

    The stations are nozzle free, gas free, clean, simple and easy to use.  Each model is designed for precise control to produce 100% yield of your SMD/BGA rework without complications. The keys are accurate closed-loop thermal feedback and intuitive easy to use software.  The IR-E3 series provides extremely high levels of profiling and process control necessary for the effective rework of the most advanced packages, including SMDs, BGAs, CSPs, QFNs, LEDs, Flip-chips, 0201-01005s and all lead-free applications.

    The PDR IR-E3 systems are available in 3 models - E3S, E3G and E3M - each configured perfectly for their respective roles.

    PDR IR-E3S

    Developed from PDR’s pioneering IR rework stations from the 1990-2000s, the IR-E3S, is the standard of the E3 Series. Featuring: Focused IR Component heating, 2250w 2-zone IR PCB preheating, precision mechanics, precision optical alignment and advanced thermal control. The E3S system is flexible, upgradeable and ideal for general purpose SMD/BGA rework on small-medium sized PCBs.

    PDR IR-E3G

    Enhanced, the E3G adds superior thermal control and twin cameras for precision alignment and process observation. Non-contact pyrometers focus on the component and the PCB, for thermal feedback to auto-profiling ThermoActive V7 software. With camera input, the software also permits still and video capture.  Mechanical advancements feature precision soft touch component pick up and placement. This system also features large IR 3050W 3-zone IR PCB preheating.

    The PDR IR-E3G has been our top selling station for many years, a clear preferred choice of our customers worldwide.  A versatile complete system that is ideal for a very wide range of SMD/BGA/ uBGA/CSP/LED applications on small-large sized PCBS.

    PDR IR-E3M

    Introduced in response to our customer demands, we took the E3G and further enhanced it for Micro-rework applications. In addition to general purpose applications, the IR-E3M’s thermal, mechanical and optical features are all precisely focused to easily deal with micro components and micro PCBs. In addition to the 3050w micro-PCB preheater, a 750w electronic Thermo Boost is included along with non-contact thermal control.  High-magnification vision assisted component alignment, pick-up and ultra-fine placement complete the micro-process handling. This system is absolutely ideal for micro component-PCB rework without complications.

    SMD/BGA rework without the complications

    Put simply, without any complications, our systems can pick and place micro components or large BGAs and reflow small or large boards with precision and control.  The PDR IR process is simple, safe and gentle.  Precise control prevents burning or damage to materials. We can visually show the process, record it and repeat it precisely every time. Anyone can learn to use these systems and they are affordable.Each of the IR-E3 Series rework systems use the same principals of PDR’s Focused IR technology, first introduced in 1987. Over 4,500 systems are now in use world-wide.  Each PDR customer made a clear well informed decision to buy PDR IR technology.  Please contact us to learn why they chose PDR.

    PDR IR-E3 Evolution

    Advanced Features

    PDR IR ReworkNo NozzlesEasy to set upPrecise SMT Process ControlPDR IR Rework
    • Advanced Focused IR component heating
      Dual-band, Lens-based, Visible IR Heating System
      Ø4-70mm, up to 55mm x 55mm components
    • Quartz IR PCB preheating
      Large-area, Two/Three Zone Dark IR
      2250/3050W, up to 360mm x 240mm heating area
    • Precision Component Pick and Placement
      Advanced Professional vacuum placement system
      Soft-touch component landing
    • Component Nest/Flux Application Facility
      Integrated nest with flux dip tray or component
      print frame and optional Optical assist
    • Precision PCB Handling
      Advanced Professional PCB table with macro-micro X/Y
      Up to 12” x 18” (300mm x 450mm) PCB size
    • Component Temperature Sensing
      Standard non-contact IR temperature sensor
    • PCB Temperature Sensing
      K-type wire thermocouple
      Optional non-contact IR temperature sensor
    • Advanced Thermal Process Control
      Automatic Thermal Control Software
    • Camera/Prism Based BGA/CSP/QFN
      Alignment System

      Split beam prism system for simultaneous
      PCB/component viewing
    • Auxiliary Process Camera (Optional)
      Auxiliary process observation camera
      Ultra-high mag camera-lens optics
    • PCB Cooling (Optional)
      Highly effective, integral PCB cooling with air
      knife system

    Detailed Technical Specifications

    • Advanced Focused IR component heating
      Dual-band Visible IR Heating system
      150W, lens based Focused IR heating with adjustable image system
      PDR lens attachments with IR image from 4 to 70mm diameter
      Reworks SMD, microSMD, BGA, uBGA, CSP, QFN, LED, uLED, 0201 etc.
    • PDR Lens Attachments
      FF150 (Ø4 - 18mm spot size)
      F200 (Ø10 - 28mm spot size)
      F400 (Ø12 - 35mm spot size)
      F700 (Ø25 - 70mm spot size)
    • Quartz IR PCB Preheating - Flexi-array Dark IR PCB preheater system
      High power, medium wave quartz IR

      E3S - 2250W, two zone (240mm x 240mm heating area) with
      750W Micro-PCB Thermo Boost
      E3G - 3050W, three zone (360mm x 240mm heating area) with
      750W Micro-PCB Thermo Boost
      E3M - 3050W, three zone (360mm x 240mm heating area) with
      750W Micro-PCB Thermo Boost

    • Advanced Professional Vacuum Placement System
      With precise ‘pick and place’ action, Y/Z axis movement and rotation via,
      Magna-Track Precision Pick-Up Assembly with Micro-Touch soft landing/component lift
      Fine approach, Z-axis stop, with LED indicators for paste placement
      Comprehensive range of micro pick-up tips for different devices
      E3M - Venturi Powered Vacuum Assist for EZ Ground Plane Detach
      (70-140PSI Shop Air)
    • Component Nest for Precision Pick-up and Flux Application
      Solder Paste/Dipping Tray facility with process Camera Verification
      Micro Part Pick-Up nest with Optical Assist
    • Advanced Professional Macro-Micro X/Y PCB Table
      Precision micrometer (micro) X/Y and micro rotation control
      +/- 5 microns (.0004”) movement in X/Y directions
      Macro movement in X/Y directions
      From 0.25”x 0.25” up to 12” x 18” (300mm x 450mm) PCB capacity with lockable X/Y axis
      E3M - Optional Universal PCB Pallet to emulate larger PCB Surface area (USA Option)
    • Component Temperature Sensing - Non-contact, IR Sensor
      Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
      Real time monitoring of component temperature throughout process
    • PCB Temperature Sensing
      Manually attached K-type thermocouple probe
      Optional non-contact IR sensor with real time temperature sensing
    • Auto Profile Process Control Software
      PDR ThermoActive software suite
      Digital controller with multi-functional features
      Advanced, Windows 7+ ThermoActive software suite
      Two channel, real time, closed loop component and PCB
      temperature control
      ‘Auto-profile’ temperature profiling, data logging and reporting
      Multi K-type thermocouple (x4) capacity for temp/time testing
    • Camera/Prism Based BGA/uBGA/CSP/QFN Alignment System
      Split beam prism system for simultaneous PCB/component viewing
      Integral LED lighting system with illumination level control
      Full colour compact camera and flat screen colour monitor
      High quality zoom lens with up to x50 magnification
      Precise X/Y axis mounting system
    • Auxiliary Process Camera (Optional)
      Auxiliary process observation camera
      Integral LED lighting system with illumination level control
      Full colour compact camera with rotation movement
      High quality zoom lens with up to x50 magnification
    • Forced Air PCB Cooling (Optional)
      Highly effective, Software controlled, integral PCB cooling with air knife system
      Switched compressed air flow, directed under the PCB

    Bench Top Requirements

    Top heat power150W IR
    Back heater power2250-3050W IR
    Voltage/frequency208-240 volts 50/60Hz, up to 3KW
    Typical componentsSMD, BGA, uBGA, QFN, LED, uLED, 0201 etc.
    Bench area1400mm (w) x 600mm (d)
    Weight65 Kg

    The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.

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    PDR IR-E3 Evolution


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