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IR-C3 Chipmate Series

Entry-Level SMD/BGA Rework Station

PDR IR-C3

Today there is a need for lower cost and upgradeable equipment without a loss in soldering quality. The PDR IR-C3 Chipmate SMT/BGA rework station, using PDR’s patented Focused IR technology, have been specifically engineered to meet this challenge.

The IR-C3 Chipmate comes with a good range of standard features allowing the operator to quickly, safely rework all types of components.

The station is tool free, gas free, instantly/precisely controllable, clean, modular and produces 100% yield BGA rework without any complications. The IR-C3 uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

The IR-C3 system is now available in 2 models - the C3S and C3i. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-C3 is one of the best performing entry level BGA Rework Stations worldwide.

 

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The PDR IR-C3 systems are available in 2 models – C3S and C3i each configured perfectly for their respective roles.

PDR IR-C3S

Our entry level IR Rework station. Simple to use digital controller with 20 slots available to save profiles, handheld suction removal. This system features a 2000W PCB preheater and can rework boards up to 12”. Designed to replace the guess work out of low/entry level repairs with visible IR Heating component heating.

PDR IR-C3i

Same great, simple design as the IR-C3S but features PDR’s award winning thermoactive software control. Designed using only the finest components in the United Kingdom. This is the perfect system for anyone who is looking to take there rework operations to the next level.

Advanced Features

PDR IR ReworkNo NozzlesEasy to set up

North American specifications may differ

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
     
  • Quartz IR PCB preheating
    2000W, two zone (240mm x 240mm heating area)
     
  • Precision Component Pick and Placement
    Professional vacuum placement system
     
  • Precision PCB Handling
    Portable Benchtop PCB workholder
     
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor
     
  • PCB Temperature Sensing
    K-type wire thermocouple
     
  • Advanced Thermal Process Control
    Digital auto profile thermal control (C3S)
    Software based thermal control (C3i)

     

Technical Specifications

North American specifications may differ

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
    PDR lens attachments with IR image from 4 to 70mm diameter
    Reworks SMDs/ BGAs/QFNs/CSPs + lead free applications
     
  • Quartz IR PCB preheating
    High power, medium wave quartz IR
    Large area IR PCB preheater system
    2000W, single zone (240mm x 240mm heating area)
    Optional 750W, single zone (120mm x 120mm heating area)
     
  • PDR lens attachments
    F150 (Ø4 - 18mm spot size) optional
    F200 (Ø10 - 28mm spot size) optional
    F400 (Ø12 - 35mm spot size) optional
    F700 (Ø25 - 70mm spot size) standard
     
  • Handheld Vacuum Placement System
    Vacuum operated pick up tool, hand held with silicon cups
     
  • Standard Vacuum Placement System (Optional)
    With precise placement action, Z axis movement and rotation
    Interchangeable pick-up heads for different application
     
  • Handheld Component Nest and Flux Application Tool (Optional)
    Handheld nest plate with ‘component print frame’ or dip tray for flux and solder paste application
     
  • Portable Benchtop PCB Workholder
    650mm, up to 12” x 10” (300mm x 250mm) PCB capacity
     
  • Component Temperature Sensing - Non-contact, IR Sensor
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process.
  • PCB Temperature Sensing - Non-contact, IR Sensor (Optional)
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process
     
  • Digital, Closed-loop Electronic Control (C3S)
    Digital programmable controller (20 internal profile storage)
    Simple key pad setting power/time/temperature controls
    2 Channel component and PCB temperature control
     
  • Auto Profile Process Control Software (C3i)
    PDR ThermoActive software suite
    Digital controller with multi-functional features
    Advanced, Windows 7+ ThermoActive software suite
    Two channel, real time, closed loop component and PCB
    temperature control
    ‘Auto-profile’ temperature profiling, data logging and reporting
    Multi K-type thermocouple (x4) capacity for temp/time testing

 

Bench Top Requirements

Top heat power150W IR
Back heater power2000W IR
Voltage/frequency110-240 volts 50/60Hz
Typical componentsCSPs, BGAs, uBGAs, QFNs, QFPs,
PLCCs, SOICs, small SMDs
Bench area1200mm (w) x 600mm (d)
Weight45 Kg

The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.

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IR-C3 Chipmate

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