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IR-TS One

Micro-Focused IR Thermal Test System

The PDR IR-TS One IR Thermal Test System

The PDR IR-TS One IR Thermal Test System has been designed to thermally cycle key critical components and assemblies to detect defects. Using PDR’s unique Non-Destructive Dual Thermal Stress Screening Process, based on a variation on HALT/HASS principles, the system is able to focus the testing on suspected problem areas to safely screen out early field failures caused by design, environmental, production and structural defects.

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PDRs Dual Thermal Step Test Process

The TS One uses PDR’s unique dual zone IR heating and gas cooling process that independently heats the PCB and component in a safe thermal cycle and can be used during live system/function HALT/HASS testing.

In component testing, the PCB is preheated whilst the Focused IR is aimed at the centre of the component to directly heat up the die, in either cycle or step test modes to check the design integrity. For Solder-joint validation the whole component is heated. All parameters such as target temperatures, ramp-rates, soak times and number of cycles are easily set and precisely controlled using PDR’s ThermoActive control software.

PDRs Dual Thermal Step Test Process

Applications include testing electronic assemblies, electronic devices, bonded structures of plastics and ceramics in a wide variety of fields including, Medical, Automotive, Avionics, Space and Defence.

PDR’s IR-TS Ones work alongside HALT/HASS Test Chambers, with the convenience of a benchtop system, so that you can FOCUS on the problem areas, greatly accelerating the process during design testing.

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Advanced Features

PDR IR-TS OnePDR IR-TS One
  • Advanced Focused IR component heating
    150W, Focused IR heating with adjustable image system
     
  • Quartz IR PCB preheating
    1200W, two zone (240mm x 240mm heating area)
     
  • Forced Air Component Cooling
    Effective and safe directed component cooling
     
  • Portable PCB Workholder
    Professional benchtop PCB workholder
     
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor
     
  • PCB Temperature Sensing
    Standard non-contact IR temperature sensor
     
  • Advanced Thermal Process Control
    Software based auto profile thermal control

Technical Specifications

  • Advanced Focused IR component heating
    150W, lens based Focused IR heating with adjustable image system
    PDR lens attachments with IR image from 4 to 70mm diameter
     
  • PDR Lens Attachments
    F200 (Ø10 - 28mm spot size) optional
    F700 (Ø25 - 70mm spot size) standard
     
  • Quartz IR PCB preheating
    High power, medium wave quartz IR
    Large area IR PCB preheater system
    Standard 1200W, 2 x 600W zones (240mm x 240mm heating area)
    Optional 750W, single zone (120mm x 120mm heating area)
     
  • Forced Air Component Cooling
    Highly effective, integral Component cooling with forced air system
    Switched compressed air flow, directed at component
     
  • Portable Benchtop PCB Workholder
    650mm, up to 12” x 10” (300mm x 250mm) PCB capacity
     
  • Component Temperature Sensing - Non-contact, IR Sensor
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process
     
  • PCB Temperature Sensing - Non-contact IR Sensor
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process
  • Auto Profile Process Control Software
    PDR ThermoActive software suite
    Digital controller with multi-functional features
    Advanced, Windows 7+ ThermoActive software suite
    Two channel, real time, closed loop component and PCB temperature control
    ‘Auto-profile’ temperature profiling, data logging and reporting
    Multi K-type thermocouple (x4) capacity for temp/time testing
     
  • Typical Temperature Ranges
    The systems uses a variation on the HALT/HASS cycle, using the positive temperature
    Cycles, whilst heating the PCB and component differentially.
    PCB Temperature range = ambient to +180°C
    Component Temperature range = 10°C to 180°C
     
  • Future Developments in Progress
    The system can be used as a single unit as pictured, or as part of a
    Production test cell, robot loaded with pallets, conveyors and buffers.
    New features will include Vibration generation, refrigeration and cryogenic cooling. 

System Requirements

Top heat power150W IR
Back heater power750W or 1200W IR
Total Power Inputup to 1400W
Voltage/frequency110-240 volts 50/60Hz
Floor area1000mm (w) x 600mm (d)
Weight45Kg

The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.

Download Brochure

IR-TS One Brochure

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