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IR-E3 Evolution Series

Ultimate Performance, BGA / uBGA / SMD / QFN Rework System for PCBs upto 18"/450mm


SMD / BGA / uBGA / QFN / LED Rework with Focused IR

The PDR IR-E3 is a high powered system, available with a multi-zone 2000W, 2800W or 3050W PCB preheater and is designed to rework SMD / BGA / uBGA / QFN / LEDs on small to medium-large PCB assemblies with upto a 18"/450mm PCB capacity. It is loaded with advanced features delivering many benefits including the highest performance and soldering quality available anywhere, yet it remains simple to set up and use.

The IR-E3 system is now available in 3 models - the E3S, E3G and E3M. Made in the United Kingdom with only the finest components for optimum precision, the PDR IR-E3 is our top selling system and one of the best performing BGA Rework Stations worldwide.

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Multi-purpose flexible rework focused on precision and simplicity

PDR’s IR-E3 series of SMD/BGA IR rework systems are engineered to cope with the challenges of repairing today’s PCB assemblies. The systems use PDR’s patented Focused IR technology, the world’s only technology that uses Dual-band Visible IR Heating. The light that heats.

The stations are nozzle free, gas free, clean, simple and easy to use.  Each model is designed for precise control to produce 100% yield of your SMD/BGA rework without complications. The keys are accurate closed-loop thermal feedback and intuitive easy to use software.  The IR-E3 series provides extremely high levels of profiling and process control necessary for the effective rework of the most advanced packages, including SMDs, BGAs, CSPs, QFNs, LEDs, Flip-chips, 0201-01005s and all lead-free applications.

The PDR IR-E3 systems are available in 3 models - E3S, E3G and E3M - each configured perfectly for their respective roles.


Developed from PDR’s pioneering IR rework stations from the 1990-2000s, the E3S, is the standard of the IR-E3 Series. Featuring: Focused IR Component heating, 2000w 2-zone IR PCB preheating, precision mechanics, precision optical alignment and advanced thermal control. The E3S system is flexible, upgradeable and ideal for general purpose SMD/BGA rework on small-medium sized PCBs.


Enhanced, the E3G adds superior thermal control and twin cameras for precision alignment and process observation. Non-contact pyrometers focus on the component and the PCB, for thermal feedback to auto-profiling ThermoActive V7 software. With camera input, the software also permits still and video capture.  Mechanical advancements feature precision soft touch component pick up and placement. This system also features large IR 2800W 3-zone IR PCB preheating.

The PDR IR-E3G has been our top selling station for many years, a clear preferred choice of our customers worldwide.  A versatile complete system that is ideal for a very wide range of SMD/BGA/ uBGA/CSP/LED applications on small-large sized PCBS.


Introduced in 2017, in response to our customer demands, we took the E3G and further enhanced it for Micro-rework applications. In addition to general purpose applications, the E3M’s thermal, mechanical and optical features are all precisely focused to easily deal with micro components and micro PCBs. In addition to the 3050w micro-PCB preheater, a 750w electronic Thermo Boost is included along with non-contact thermal control.  High-magnification vision assisted component alignment, pick-up and ultra-fine placement complete the micro-process handling. This system is absolutely ideal for micro component-PCB rework without complications.

SMD/BGA rework without the complications

Put simply, without any complications, our systems can pick and place micro components or large BGAs and reflow small or large boards with precision and control.  The PDR IR process is simple, safe and gentle.  Precise control prevents burning or damage to materials. We can visually show the process, record it and repeat it precisely every time. Anyone can learn to use these systems and they are affordable.

Each of the IR-E3 Series rework systems use the same principals of PDR’s Focused IR technology, first introduced in 1987. Over 4,500 systems are now in use world-wide.  Each PDR customer made a clear well informed decision to buy PDR IR technology.  Please contact us to learn why they chose PDR.

PDR IR-E3 Evolution

Advanced Features

PDR IR ReworkNo NozzlesEasy to set upPrecise SMT Process ControlPDR IR Rework
  • Advanced Focused IR component heating
    Dual-band Visible IR Heating system
    150W, lens based Focused IR heating with adjustable
    image system Ø4-70mm
  • Quartz IR PCB preheating
    E3S - 2000W, two zone (240mm x 240mm heating area)
    E3G - 2800W, three zone (360mm x 240mm heating area)
    E3M - 3050W, three zone (240mm x 240mm heating area)
    with 750W Micro-PCB Thermo Boost
  • Precision Component Pick and Placement
    Advanced Professional vacuum placement system
    Soft-touch component landing
  • Component Nest/Flux Application Facility
    Integrated nest with flux dip tray or component
    print frame and optional Optical assist
  • Precision PCB Handling
    Advanced Professional PCB table with macro-micro X/Y
  • Component Temperature Sensing
    Standard non-contact IR temperature sensor
  • PCB Temperature Sensing
    K-type wire thermocouple
    Optional non-contact IR temperature sensor
  • Advanced Thermal Process Control
    Software based auto profile thermal control
  • Camera/Prism Based BGA Alignment
    Split beam prism system for simultaneous
    PCB/component viewing
    High mag camera-lens optics
  • Auxiliary Process Camera (Optional)
    Auxiliary process observation camera
    Ultra-high mag camera-lens optics
  • PCB Cooling (Optional)
    Highly effective, integral PCB cooling with air
    knife system

Technical Specifications

  • Advanced Focused IR component heating
    Dual-band Visible IR Heating system
    150W, lens based Focused IR heating with adjustable image system
    PDR lens attachments with IR image from 4 to 70mm diameter
    Reworks 01005 - 0605, CSP, Flip Chip, QFN, uBGA, BGA and SMDs
  • PDR Lens Attachments
    F150 (Ø4 - 18mm spot size) optional
    F200 (Ø10 - 28mm spot size) optional
    F400 (Ø12 - 35mm spot size) optional
    F700 (Ø25 - 70mm spot size) standard
  • Quartz IR PCB preheating Flexi-array Dark IR PCB preheater system
    High power, medium wave quartz IR

    E3S - 2000W, 2 zones (240mm x 240mm heating area)
    E3G - 2800W, 3 zones (360mm x 240mm heating area)
    E3M - 3050W, 3 zones (240mm x 240mm heating area)
    with 750W, Electronic Thermo-Boost for small PCBs

  • Advanced Professional Vacuum Placement System
    With precise ‘pick and place’ action, Y/Z axis movement and rotation via,
    Magna-Track Precision Pick-Up Assembly with Micro-Touch soft landing/component lift
    Fine approach, Z-axis stop, with LED indicators for paste placement
    Comprehensive range of micro pick-up tips for different devices
    E3M - Venturi Powered Vacuum Assist for EZ Ground Plane Detach
    (70-140PSI Shop Air)
  • Component Nest for Precision Pick-up and Flux Application
    Solder Paste/Dipping Tray facility with process Camera Verification
    Micro Part Pick-Up nest with Optical Assist
  • Advanced Professional Macro-Micro X/Y PCB Table
    Precision micrometer (micro) X/Y and micro rotation control
    +/- 5 microns (.0004”) movement in X/Y directions
    Macro movement in X/Y directions
    From 0.25”x 0.25” up to 12” x 18” (300mm x 450mm) PCB capacity with lockable X/Y axis
    E3M - Optional Universal PCB Pallet to emulate larger PCB Surface area
  • Component Temperature Sensing - Non-contact, IR Sensor
    Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
    Real time monitoring of component temperature throughout process


  • PCB Temperature Sensing
    Manually attached K-type thermocouple probe
    Optional non-contact IR sensor with real time temperature sensing
  • Auto Profile Process Control Software
    Advanced PDR ThermoActive software suite, Windows 7+
    Digital controller with multi-functional features
    Two channel, real time, closed loop component and PCB temperature control
    ‘Auto-profile’ temperature profiling, data logging and reporting
    Optional PC System with 17-23-27” Monitor Selection
  • Camera/Prism Based BGA/uBGA/CSP/QFN Alignment System
    Split beam prism system for simultaneous PCB/component viewing
    Hi-Resolution USB Cube Camera(s) 55FPS
    150° rotation, 60X Magnification Lens + Digital Magnification up to 8X
    Video Capture, Annotate, and Camera Lighting Control functions
    Integral LED lighting system with illumination level control
  • Auxiliary Process Camera
    Auxiliary process observation camera
    Full colour compact USB Cube camera with rotation movement
    High quality zoom lens with up to x50 magnification
    Integral LED lighting system with illumination level control
  • Forced Air PCB Cooling
    Highly effective, Software controlled, integral PCB cooling with air knife system
    Switched compressed air flow, directed under the PCB

Bench Top Requirements

Top heat power150W IR
Back heater power2000-3050W IR
Voltage/frequency208-240 volts 50/60Hz, up to 3KW
Typical componentsCSP, Flip Chip, QFN, uBGA, BGA, SMDs
PLCCs, SOICs, 01005 - 0605s, small SMDs
Bench area1400mm (w) x 600mm (d)
Weight65 Kg

The above features are mostly optional and also, PDR reserves the right to improve or change specifications without giving notice.



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PDR IR-E3 Evolution

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